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Monday, October 12, 15:00, Room “B”

MICROSYSTEM  TECHNOLOGY 1
Session MT1: Oral presentations

Chair: 
D. Dascalu, IMT-Bucharest, Romania
C. Cobianu, Honeywell, Bucharest, Romania

Invited
Paper
15:00

TRANSDERMAL DRUG DELIVERY: MICROFABRICATION INSIGHTS, C. Iliescu, B. Chen, J. Wei, Z. Yue, Inst. of Bioengineering and Nanotechnology, Singapore.

 

MT1. 1
15:30

CAPACITIVE MEMS ENERGY HARVESTERS FOR STRUCTURAL MONITORING: DESIGN AND FABRICATION, G. De Pasquale, M. Wei*, A. Soma, J. Wang*, Politecnico di Torino, Italy, *Univ. of South Florida, Tampa, USA.

MT1. 2
15:50

WAFER BONDING WITH METAL LAYERS FOR MEMS APPLICATIONS, V. Dragoi, E. Cakmak*, E. Pabo*, EV Group, St. Florian/Inn, Austria, *EV Group Inc., Tempe, AZ, USA.

MT1. 3
16:10

ELECTRET BASED CAPACITIVE MEMS VIBRATION-TO-ELECTRIC ENERGY HARVES-TING, R. Mialtu, M. Sararoiu, Infineon Technologies Romania, Bucharest, Romania.

MT1. 4
16:30

INTEGRATED MICRO HEAT SINK BASED ON MICROCHANNELS MICROFABRICATED ONTO SILICON, A. Coraci, E. Iancu, I.M. Stanca, C. Parvulescu, O. Corici*, IMT-Bucharest, *Oilfield Schlumberger, Bucharest, Romania.

MT1.5
16:50

REALISATION OF MICROFLUIDIC COMPONENTS USING THE CASTING REPLICATION METHOD, I. Stanciu, P. Obreja, L. Eftime, D. Cristea, R. Muller, D. Dascalu, IMT-Bucharest, Romania.

17:00–17:30   COFFEE  BREAK

 

 


 
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