Tool Name: Dicing saw equipment

Manufacturer: Riga  Tec (Latvia)

Model: EM225

Tool responsible: chem. Staicu Liliana

Process responsible: chem. Staicu Liliana

Responsible group: eng. Adrian Albu

Status and tool description : Dicing saw equipment   for 2, 3, and 4   inch wafers minimal  deepness 5- 500 microns  for silicon. It is possible to cut glass of  600 microns step by step.  Alignment precision for inter chip : below 5 microns  Alignment and visual control of the dicing is made using the monitor.  The equipment can be used with different saws having the thickness of    40-300 microns

Applications:  separations of  semiconductor chips,  glass devices

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Application scientist: chem. Staicu Liliana, liliana.staicu@imt.ro

eng. Adrian Albu, adrian.albu@imt.ro

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Last update: February 19, 2009