MINAFAB Processing equipments

Double Side Mask Aligner - MA6/BA 6 (Suss MicroTec);

 

Description

4”,5”, fragments >5x5 cm;
Alignement range: X: ± 10 mm; Y: ± 5 mm ; Θ: ± 5º. Mechanical increment resolution: 0.1 µm.
Top side alignment (TSA) – optical microscope “split field”, 0.5 µm.
Bottom side alignment – high resolution LCD cameras, 0.1 µm.
Enhanced Image Storage System (EISS).
Exposure: contact, vacuum, proximity, flood.
UV 365 nm, 1000 W (Hg).
DEEP UV 249 nm 500 W (Hg / Xe).
UV- NIL

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Applications:

  • Equipment for alignment/exposure nanolithography and nanoimprint: Double face exposure alignment equipment, UV, nanoprint 4’’-6’’.

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Application scientist: eng. Adrian Albu,  adrian.albu@imt.ro

 

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Last update: February 27, 2011