MINAFAB Processing equipments

Reactive Ion Etching (RIE) Plasma Etcher- Etchlab 200
Contact persons: Andrei Avram, PhD stud; Marioara Avram, PhD

Applications:

Typical applications for the basic configuration are:

  • the etching of dielectrics (SiO2, Si3N4),
  • semiconductors (Si),
  • polymers and metals (Au, Pt, Ti, Ni).

General description:

The Etchlab 220 is a single wafer Reactive Ion Etching (RIE) machine. The substrates (wafer, carrier, small pieces) are directly loaded onto the substrate electrode after venting and opening the reactor. The control of the process can be manual or automated, using the included Sentech software. The recipe is controlled directly through the software, the gas concentration can be easily set by the technician.

Characterization:

    • High etch rate
    • Low damage
    • Superior homogeneity
    • Remote field control via serial field bus
    • SENTECH’s plasma process systems operating software
    • Through-the-wall installation
    • Interferometric endpoint detection and etch depth measurement
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Application scientist: dr. phys. Marioara Avram ,  marioara.avram@imt.ro

 

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Last update: February 27, 2011