Main Technological and Characterization Tools
Microlithography tools
- Laser lithography system - DWL 66 fs, direct writing laser, high resolution pattern generator (Heidelberg Instruments Mikrotechnik, Germany); [details]
- Double Side Mask Aligner - MA6/BA6 (Suss MicroTec, Germany); [details]
- Wafer spinners - DELTA 10 (Suss MicroTec, Germany), etc. [details]
Physical deposition tools
- Electron Beam Evaporation an DC sputtering system - AUTO 500 (BOC Edwards, UK); [details]
- Electron Beam Evaporation system - EVD 500A (Neva, Japan); [details]
- Vacuum coating system, boat evaporation - BAK-500 (Balzers, Switzerland); [details]
Chemical deposition tools
Dry etching tools
- RIE Plasma Etcher - Etchlab 200 (SENTECH Instruments, Germany); [details]
Thermal processing tools
- Furnace - oxidation, diffusion, sintering - Lindberg [details]
- Furnace - rapid thermal processing/annealing - AS-One (AnnealSys, France) - to be installed soon
SEM; Electron-beam lithography; Nanoprinting
- Electron beam lithography and nanoengineering workstation - e_Line (Raith, Germany ) [details]
- Field Emission Gun Scanning Electron Microscope (FEG-SEM) - Nova NanoSEM 630 (FEI Company, USA) [details]
- Scanning Electron Microscope - Vega II LMU @ Pattern Generator - PG Elphy Plus (TESCAN s.r.o , Czech Republic @ Raith, Germany) [details]
- Dip Pen Nanolithography Writer - NSCRIPTOR (NanoInk, Inc., USA) [details]
SPM: AFM, STM, LFM, Phase Imaging, Force Modulation, Force Spectroscopy, SNOM, confocal, SECM
- Scanning Probe Microscope - NTEGRA Aura (NT-MDT Co., Russia) [details]
- Scanning Near-field Optical Microscope - Witec alpha 300S (Witec, Germany) [details]
- Scanning Electrochemical Microscope - ElProScan (HEKA, Germany) [details]
Nanomechanical characterization tools
- Nanomechanical Characterization equipment - Nano Indenter G200 - (Agilent Technologies, USA) [details]
Diffractometry; Interferometry; Spectroscopy; Voltammetry
- X-ray Diffraction System (triple axis rotating anode) - SmartLab - 9kW rotating anode, in-plane arm (Rigaku Corporation, Japan) [details]
- High Resolution Raman Spectrometer - LabRAM HR 800 (HORIBA Jobin Yvon, Japan) [details]
- Spectroscopic ellipsometer - SE 800 XUV (SENTECH Instruments, Germany) [details]
- White Light Interferometer - Photomap 3D (FOGALE nanotech, France) [details]
- Combined Time Resolved and Steady State Fluorescence Spectrometer - FLS920P (Edinburgh Instruments, UK) [details]
- Electrochemical Impedance Spectrometer - PARSTAT 2273 (Princeton Applied Research, USA) [details]
- Voltammetry and polarography analysis system - TRACELAB 50 (Radiometer Analytical, France)
- Dynamic Electrochemical Laboratory - VoltaLab 40: PGZ301 Universal Potentiostat/ Galvanostat & VoltaMaster 4 software (EIS, Voltammetry) (Radiometer Analytical, France)
- UV-VIS-NIR Spectrophotometer - SPECORD M42 (Zeiss, Germany) [details]
- Fourier–Transform Infrared Spectrometer - Tensor 27 (Bruker Optics, Germany) [details]
- UV-Vis-NIR Thermo-Electric Cooled Fiber Optic Spectrometer - AvaSpec-2048 TEC (Avantes, The Netherlands) [details]
- NIR Spectrometer - AvaSpec NIR256-2.2 (Avantes, The Netherlands) [details]
Microarrays, Biomolecule research
- Micro-Nano Plotter - OmniGrid ( Genomic Solutions Ltd., UK) [details]
- Microarray Scanner - GeneTAC UC4 (Genomic Solutions Ltd., UK) [details]
- Zeta Potential and Submicron Particle Size Analyzer - DelsaNano (Beckman Coulter, USA) [details]
Probers, on-wafer; electrical characterization
- Microwave network analyzer (0.04-65 GHz) with Manual Probing Station - Lightning 37397D VNA/Anritsu; PM5/Suss MicroTec (Anritsu, Japan; Suss MicroTec, Germany)
- Wafer Probing Station - Easyprobe EP4 (Suss MicroTec, Germany) [details]
- Semiconductor Characterization System (DC) with Wafer Probing Station - 4200-SCS/C/Keithley Easyprobe EP6/ Suss MicroTec (Keithley Instruments, USA; Suss MicroTec, Germany) [details]
- Semiconductor Characterization System - 4200-SCS, C-V 3532-50, DMM 2700-7700, 2002, 6211-2182 (Keithley Instruments, USA) [details]
Reliability and Testing Tools
- Climatic Chamber - CH 160 (Angelantoni, Italy) [details]
- Thermal shock chamber - TSE-11-A (Espec Europe, Germany) [details]
- Free Fall Shock Machine - 0707-20 (MRAD, USA) [details]
- Highly Accelerated Stress Test Chamber - temperature, humidity, pressure, polarization - EHS-211M (Espec Europe, Germany) [details]
- Mobile Thermal Airstream System - ThermoStream TP04300A-8C3-11 (Temptronic, USA) [details]
- Electrodynamic vibration system with thermal and electrical tests - TV 55240/LS (TIRA, Germany) [details]
- Universal Ovens with electrical testing - UFB (Memmert, Germany) N6711A (N6741B,N6743B,N6746B,N6773A) (Agilent Tehchnologies, USA)[details]
Wetbenches
- Masks processes: resist development, Cr etching, resist removal, DI cleaning (Atechim, Romania) [details]
- Acid processes and DI rinsing (Atechim, Romania) [details]
- Solvent bench (Atechim, Romania) [details]
- Other wet processes (Salare, USA)
Other tools
- Pulse Laser for micromachining - (EKSPLA, Lithuania) [details]
- 3D printer [details]
- Dicing saw - EEM 225 (Riga Tec, Latvia) [details]
- Ion Implantation System [details]
- Die Bonding System
- Wire Bonding System
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