Applications:

• Bonding processes:
  • Silicon to silicon
  • Silicon to glass
  • Pressure/heat assisted polymer bonding
  • Adhesive/pressure/heat assisted bonding

General Characteristics :

• Lower hot bond chuck with temperature control from ambient to 500oC
• Negative High Voltage DC power supply for Anodic bonding
• Flexible process: can accommodate polymer and adhesive bonding of different substrates

Performance:

• temperature control ± 3oC
• temperature uniformity ± 2%
• up to 8kN applied force
• process vacuum pressure down to 5*10-4 mbar

Advantages:

• Strong durable bonds
• Excellent for encapsulation
• Excellent for enclosure of fluidic microchannels
• User friendly recipe editor for non-standard processes