Reliability
Analyses:
• Testing at unique or combined stresses (mechanical, thermal,
environmental, etc.), based on modern test facilities of the laboratory
- Link la “Main Technological and Characterization
Tools” / “Reliability and Testing Tools”:
• Climatic Chamber - CH 160 (Angelantoni, Italy)
[details]
• Thermal shock chamber - TSE-11-A (Espec Europe, Germany)
[details]
• Free Fall Shock Machine - 0707-20 (MRAD, USA)
[details]
• Highly Accelerated Stress Test Chamber - temperature, humidity,
pressure, polarization - EHS-211M (Espec Europe, Germany)
[details]
• Electrodynamic vibration system with thermal and electrical tests - TV
55240/LS (TIRA, Germany) [details]
• Universal Ovens with electrical testing - UFB (Memmert, Germany) N6711A
(N6741B, N6743B, N6746B, N6773A) (Agilent Technologies, USA)[details]
• Electrical characterising at various temperatures
- Link la “Main Technological and Characterization Tools” / Probers,
on-wafer; electrical characterization:
• Semiconductor Characterization System - 4200-SCS, C-V 3532-50, DMM
2700-7700, 2002, 6211-2182 (Keithley Instruments, USA)
[details]
• Mobile Thermal Airstream System - ThermoStream TP04300A-8C3-11
(Temptronic, USA) [details] - mutat de la “Main
Technological and Characterization Tools” / “Reliability and Testing
Tools”
• Collaboration with Microphysical Characterization Laboratory of IMT
(for failure analysis) |