Project description

The aim of this project is to develop an integrated system for interconnection of five resonance sensors, having the sensitivity for measurement of temperature, force, pressure, viscosity different concentration of chemicals.
The resonance dies, to be developed will work on the basis of thickness shear having as basis the theory of working mode. It will be used advanced technologies only not for microsensors fabrication but also for their 3D packaging. The potential applications are looking for much more fields like industrial activities, agriculture, medical and environment protection.
For to realize this aim is necessary an interdisciplinary research because have to be covered following directions of research and development like: nonstandard materials (piezoelectric substrates), research of device simulation and modelling, research of microsystem technologies (the fabrication of microsensors on piezoelectric substrate improve individually technological processing for films deposition, lithography a.s.o.), research of sensors packaging like 3D also sensors with integrated electronics for analysis, MCM`s techniques for to realize smart detection system, control and analysis.
In order to realize these 3 requirements is need the development of specials lay-outs, and also of special sensitive materials (some of them nanostructure possibility)