V. DRAGOI, G. MITTENDORFER, C. THANNER, M. ALEXE, L. PINTILIE, M. HAMACHER, H. HEIDRICH
Adhesive Wafer Bonding for Wafer-Level Fabrication of Microring Resonators

Abstract.
GaInAsP/InP passive microring resonator devices were successfully fabricated using a vertical integration concept with GaInAsP/InP-on-GaAs wafer bonding. BCB adhesive bonding has been identified as the preferred wafer bonding process. This paper reports results on the development of the wafer bonding and on the microring fabrication.

Keywords: microring resonators, adhesive wafer bonding, BCB.

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