Activities (1)

Silicon micromachining for microphotonics

SOI –based microphotonic components (micro-mirrors, optical waveguides)

Process steps:
- Si etching (RIE)
- SiO2 etching in HF solution

a)	b)
c)
SEM images of suspended SOI-based  microstructures: a) movable micromirror 100x100 mm2 b) movable micromirror 50x50 mm2; c) bridge. Si thickness: 2 mm; air gap: 2 mm
a)	b)
silicon optical  waveguides on SOI wafers: aoptical magine; b) SEM imagine  Si thickness: 2 mm; SiO2 thickness 2 mm