Reliability Analyses:

  • Testing at unique or combined stresses (mechanical, thermal, environmental, etc.), based on modern test facilities of the laboratory - Link la “Main Technological and Characterization Tools” / “Reliability and Testing Tools”:
  • Climatic Chamber - CH 160 (Angelantoni, Italy) [details]
  • Thermal shock chamber - TSE-11-A (Espec Europe, Germany) [details]
  • Free Fall Shock Machine - 0707-20 (MRAD, USA) [details]
  • Highly Accelerated Stress Test Chamber - temperature, humidity, pressure, polarization - EHS-211M (Espec Europe, Germany) [details]
  • Electrodynamic vibration system with thermal and electrical tests - TV 55240/LS (TIRA, Germany) [details]
  • Universal Ovens with electrical testing - UFB (Memmert, Germany) N6711A (N6741B, N6743B, N6746B, N6773A) (Agilent Technologies, USA)[details]
  • Electrical characterising at various temperatures - Link la “Main Technological and Characterization Tools” / Probers, on-wafer; electrical characterization:
  • Semiconductor Characterization System - 4200-SCS, C-V 3532-50, DMM 2700-7700, 2002, 6211-2182 (Keithley Instruments, USA) [details]
  • Mobile Thermal Airstream System - ThermoStream TP04300A-8C3-11 (Temptronic, USA) [details] - mutat de la “Main Technological and Characterization Tools” / “Reliability and Testing Tools”
  • Collaboration with Microphysical Characterization Laboratory of IMT (for failure analysis)