Typical applications for the basic configuration are:
- the etching of dielectrics (SiO2, Si3N4),
- semiconductors (Si),
- polymers and metals (Au, Pt, Ti, Ni).
The Etchlab 220 is a single wafer Reactive Ion Etching (RIE) machine. The substrates (wafer, carrier, small pieces) are directly loaded onto the substrate electrode after venting and opening the reactor. The control of the process can be manual or automated, using the included Sentech software. The recipe is controlled directly through the software, the gas concentration can be easily set by the technician.