Multi-Scale Thermo-Mechanics for Electronics Packaging
Functionality and reliability are major requirements for future electronic systems, where electronics packaging comes in as a key enabler, being at the same time strongly driven by materials development and understanding. The talk introduces modern thermo-mechanical reliability concepts based on physics-of-failure paradigms and demonstrates their application using results from current examples of heterogeneously integrated systems, including power electronics, microelectronics, LED and MEMS. Topical multi-scale approaches, touching on material characterisation, experimental analysis and simulation from the structure of the materials up to system level, are presented and evaluated. Thus it is shown, that modern lifetime assessment modelling and prediction is an indispensable and scientifically challenging topic for both industry and applied university research and embeds it into an holistic view considering production and traceability. It will also be discussed how this methodology can meet the challenges of the complex developments ahead.