Technical presentations from Sponsors
➯ Technical presentations from our GOLD Sponsors and their partners:
- An Integrated Workflow from EFA to Automated TEM for Materials and Device Characterization in the AI Era - Ondrej Baco, Product Marketing Manager - Semiconductor SEM & SDB, Thermo Fisher Scientific, Czech Republic (RONEXPRIM partner) - Wednesday, October 14, 11:40-11:50
Abstract: AI-driven semiconductor architectures are increasing complexity across logic, memory, and advanced packaging, creating new challenges for failure analysis and materials characterization. This presentation highlights a connected workflow that moves from electrical fault localization to physical root-cause analysis and nanoscale materials insight. Examples include backside power-delivery networks, buried metal/via defects, HBM structures, hybrid bonding, and advanced package interconnects. The workflow combines ion beam chemistry assisted delayering and electron probing, PFIB large area cross sectioning and Ga FIB TEM sample preparation followed by automated S/TEM imaging including EDS and EELS. By integrating these capabilities with automation, the approach improves localization, measurement consistency, throughput, and time to data. The central message is that the next frontier is not resolution alone, but repeatable, automated insight—from device fault to material and structural understanding.
- Nanoscale Metrology and Correlative Solutions for Semiconductor Technology – Dr. Gabriele Selvaggio, Oxford Instruments GmbH, Germany (NANOTEAM partner) - Thursday, October 15, 11:30-11:40
- Analog Devices Romania - Adrian Costea, Evelyn Plesca - Thursday, October 15, 11:40-11:50
- Ensuring a safer and connected world with leading solutions from Rohde & Schwarz - Cristian Bolovan-Paven, Rohde & Schwarz Romania - Friday, October 16, 11:30-11:40
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